JPH0452635B2 - - Google Patents

Info

Publication number
JPH0452635B2
JPH0452635B2 JP58151575A JP15157583A JPH0452635B2 JP H0452635 B2 JPH0452635 B2 JP H0452635B2 JP 58151575 A JP58151575 A JP 58151575A JP 15157583 A JP15157583 A JP 15157583A JP H0452635 B2 JPH0452635 B2 JP H0452635B2
Authority
JP
Japan
Prior art keywords
fiber
hole
optical fiber
support
stem
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP58151575A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6043889A (ja
Inventor
Akira Ishii
Tsugio Nemoto
Kunio Aiki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Renesas Eastern Japan Semiconductor Inc
Original Assignee
Hitachi Ltd
Hitachi Tohbu Semiconductor Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd, Hitachi Tohbu Semiconductor Ltd filed Critical Hitachi Ltd
Priority to JP58151575A priority Critical patent/JPS6043889A/ja
Priority to GB08420547A priority patent/GB2146841B/en
Priority to DE19843430762 priority patent/DE3430762A1/de
Priority to US06/643,259 priority patent/US4702556A/en
Publication of JPS6043889A publication Critical patent/JPS6043889A/ja
Priority to US07/085,761 priority patent/US4834492A/en
Priority to US07/279,458 priority patent/US4883342A/en
Publication of JPH0452635B2 publication Critical patent/JPH0452635B2/ja
Granted legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4202—Packages, e.g. shape, construction, internal or external details for coupling an active element with fibres without intermediate optical elements, e.g. fibres with plane ends, fibres with shaped ends, bundles
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/422—Active alignment, i.e. moving the elements in response to the detected degree of coupling or position of the elements
    • G02B6/4226—Positioning means for moving the elements into alignment, e.g. alignment screws, deformation of the mount
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4248—Feed-through connections for the hermetical passage of fibres through a package wall
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12041—LED
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1204—Optical Diode
    • H01L2924/12042—LASER
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S359/00—Optical: systems and elements
    • Y10S359/90—Methods

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Led Device Packages (AREA)
  • Semiconductor Lasers (AREA)
JP58151575A 1983-08-22 1983-08-22 光ファイバー付レーザーダイオード装置の組立方法 Granted JPS6043889A (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP58151575A JPS6043889A (ja) 1983-08-22 1983-08-22 光ファイバー付レーザーダイオード装置の組立方法
GB08420547A GB2146841B (en) 1983-08-22 1984-08-13 Light emitting device
DE19843430762 DE3430762A1 (de) 1983-08-22 1984-08-21 Licht emittierendes bauelement
US06/643,259 US4702556A (en) 1983-08-22 1984-08-22 Method of assembling a light emitting device with an optical fiber
US07/085,761 US4834492A (en) 1983-08-22 1987-08-17 Light emitting device with an optical fiber and a deformable support member for supporting the optical fiber
US07/279,458 US4883342A (en) 1983-08-22 1988-12-05 Method of assembling a light emitting device with an optical fiber

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58151575A JPS6043889A (ja) 1983-08-22 1983-08-22 光ファイバー付レーザーダイオード装置の組立方法

Publications (2)

Publication Number Publication Date
JPS6043889A JPS6043889A (ja) 1985-03-08
JPH0452635B2 true JPH0452635B2 (en]) 1992-08-24

Family

ID=15521513

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58151575A Granted JPS6043889A (ja) 1983-08-22 1983-08-22 光ファイバー付レーザーダイオード装置の組立方法

Country Status (4)

Country Link
US (3) US4702556A (en])
JP (1) JPS6043889A (en])
DE (1) DE3430762A1 (en])
GB (1) GB2146841B (en])

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EP0241669A1 (de) * 1986-03-12 1987-10-21 Siemens Aktiengesellschaft Verfahren zum Befestigen und Justieren eines Endabschnittes einer Glasfaser

Also Published As

Publication number Publication date
US4883342A (en) 1989-11-28
US4702556A (en) 1987-10-27
JPS6043889A (ja) 1985-03-08
GB2146841B (en) 1987-11-18
GB8420547D0 (en) 1984-09-19
DE3430762A1 (de) 1985-03-14
US4834492A (en) 1989-05-30
GB2146841A (en) 1985-04-24

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